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Product > Copper Plates > Materials
 

Correct material selection is vital for the reliable performance of copper plates. At SUMMITTEK, constant improvements have been made to all aspects of materials examination and selection from design, through quality control and refurbishment to failure analysis. Our unique technical strength in material selection resutls in improved product quality and better product lifecycle.

 

There are two choices of materials when you order SUMMITTEK Mould Plates: Cu-Ag and Cu-Cr-Zr.

Cu-Cr-Zr materials have higher rigidity and hardness with re-crystallizer temperature up to 700℃, which effectively avoids reduction of mechanical properties and mould plate distortion resulted from recrystallization, while CuAg materials hardness begins to reduce at a rather lower temperature of 300℃. The properties of both materials are compared as the following table:

 

Characteristics CuAg Cu-Cr-Zr
Melting Point

1083℃

1083℃

Coefficient of thermal expansion at 20oC

1,68x10-5

1,70x10-5

Thermal conductivity at 200C

377 W/(m.k)

325 W/(m.k)

Recrystallization

370℃

700℃

Hardness at 200C

Min. 90 HB

Min. 120 HB

 

 

 
 

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